Re-imagining Acoustic Filters with Piezo-On-Insulator (POI) Technology Platform

Speaker Information

Xavier Seah

Xavier Seah

SOITEC

Abstract

The Piezo-On-Insulator (POI) technology platform represents a revolutionary advancement in acoustic filter design, offering unprecedented performance capabilities for next-generation RF front-end modules. This presentation introduces the innovative POI substrate technology, which combines thin single-crystal piezoelectric films with advanced insulator layers to create superior acoustic wave propagation environments. We will explore how POI technology enables significantly improved Q factors, enhanced power handling capabilities, and superior temperature stability compared to conventional SAW and BAW technologies. The presentation will cover the fundamental principles of POI operation, including acoustic wave confinement effects, reduced substrate losses, and optimized electromechanical coupling coefficients. We will also discuss manufacturing scalability, integration challenges with existing RF front-end architectures, and real-world implementation case studies in 5G and Wi-Fi 6/7 applications. Additionally, we will present performance benchmarks comparing POI-based filters with traditional acoustic filter technologies, demonstrating clear advantages in insertion loss, rejection levels, and power handling capabilities.

Speaker Biography

Xavier Seah is a Senior Application Engineer at SOITEC, bringing extensive expertise in advanced semiconductor technology platforms and their applications in RF and acoustic filter devices. With a strong background in materials science and RF engineering, Xavier has been instrumental in developing and promoting POI technology for next-generation communication systems. His work focuses on helping customers integrate POI substrates into their RF filter designs, optimizing performance for specific applications, and driving innovation in acoustic wave technology.

Key Achievements:

  • Expert in POI substrate technology and applications
  • Specialized in RF front-end module integration
  • Experience in acoustic filter design optimization
  • Contributed to POI technology commercialization
  • Knowledgeable in 5G and advanced communication system requirements